摘要
5G时代的到来将通信系统的工作频段推入毫米波波段,这给毫米波器件的封装带来了挑战.5G系统需要将射频、模拟、数字功能和无源器件以及其他系统组件集成在一个封装模块中,这个要求恰恰体现了异质异构集成的特征.在所有的异质异构集成解决方案中,2.5D/3D系统级封装(System in Package,SiP)因其高度集成化被视为解决5G系统封装的重要突破口.文章以SiP为切入口,着重介绍了未来5G封装发展重点的2.5D/3D SiP技术以及目前备受瞩目的Chiplet技术.基于5G毫米波器件的系统级封装解决方案,探讨了适用于毫米波器件封装的基板材料以及SiP所需的先进封装技术.最后,针对5G天线模块的封装,介绍了片上天线和封装天线两种解决方案.
The advent of the 5G era pushed the working frequency band of communication systems into the millimeter wave band,which brings challenges to the packaging of millimeter wave devices.The requirement for 5G systems to integrate RF,analog,digital functions and passive components and other system components in a single package module reflects the characteristics of heterogeneous integration.Among all heterogeneous integrated solutions,2.5D/3D system-inpackage(SiP)is considered as a breakthrough to solve 5G system packaging because of its high integration.Taking SiP as the entry point,the review focuses on the 2.5D/3D SiP technology and the Chiplet technology,which has attracted much attention.Based on the system-in-package solution for 5G mm wave devices,the substrate materials suitable for mm wave device packaging and the advanced packaging technologies required for SiP were discussed.In addition,the review also introduced two solutions:on-chip antenna and packaged antenna for the packaging of 5G antenna modules.
作者
张墅野
邵建航
何鹏
ZHANG Shuye;SHAO Jianhang;HE Peng(School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001,China)
出处
《微电子学与计算机》
2023年第11期9-21,共13页
Microelectronics & Computer
基金
国家重点研发计划项目(2020YFE0205304)
中央高校基本科研业务费专项(AUGA5710051221)
黑龙江省自然科学基金项目(YQ2022E024)
重庆市自然科学基金项目(cstc2021jcyj-msxmX1002)
中国科学院硅器件技术重点实验室开放基金项目(KLSDTJJ2022-5)。
