聚焦深度及偏转角度对超声相控阵检测定量和定位的影响

Effect of Aggregation Depth and Dacoustic Beam Angle on the Quantification and Localization of Ultrasonic Phased⁃array Detection

聚焦与偏转是超声相控阵声场区别于普通超声声场的两大特性,为研究聚焦深度和偏转角度对超声相控阵检测结果的影响,通过设置比较试验,以不同深度的横通孔模拟缺陷,分析了不同聚焦深度以及带楔块偏转角度对超声相控阵检测定量和定位的影响。结果表明,当带楔块偏转角度较大时,超声相控阵检测对于缺陷的定位会产生较大偏差;对于聚焦深度附近范围内缺陷检测,其定位误差较小。而由于经过了TCG校准,不同聚焦深度和不同偏转角度下超声相控阵检测对于缺陷的定量基本保持一致,但在非校准孔深度处检测的横通孔当量会略低于校准孔深度处检测的横通孔当量。

Focusing and deflection are two characteristics that distinguish the ultrasonic phased array sound field from the ordinary ultrasonic sound field.In order to investigate the impact of focusing depth setting and deflection angle on the ultrasonic phased array detection results,the influence of different focusing depths and different deflection angles with wedges on the quantitative and localization of ultrasonic phased array detection has been analyzed by setting up comparative experiments to simulate defects with different depths of cross⁃pass holes.The results show that when the deflection angle of the band wedge is large,the ultrasonic phased array will have a large deviation for the localization of defects.For the detection of defects in the depth range near the focusing depth,the localization error is relatively small.As a result of TCG calibration,the quantification of defects by the ultrasonic phased array at different focusing depths and different deflection angles is basically consistent,but the through⁃hole equivalent detected at the depth of non⁃calibrated holes is slightly lower than that detected at the depth of calibrated holes.