高温压力传感器无引线封装研究

Research on leadless packaging for high temperature pressure sensor

针对高温压力传感器有引线封装在恶劣环境下的弊端,本文对无引线封装进行研究。首先,对无引线封装结构进行设计,并明确了适用无引线封装的高温压力敏感芯片结构;其次,研究了耐高温低应力气密封装工艺、低应力黏片工艺、无引线电气互联工艺,并实现工艺兼容。最后,将该无引线封装结构应用于高温压力敏感芯片,评估无引线封装效果。经测试,无引线封装结构漏率为10E-8 Pa·L/s,工作温度达300℃。本文的研究将拓展高温压力传感器应用领域,提高传感器恶劣环境的适应性及可靠性。

In view of the disadvantages of high temperature pressure sensor with lead packaging in harsh environment,this pa‐per researches studies on the leadless packaging.Firstly,the leadless packaging structure is designed and the high temperature pres‐sure sensor chip which is suitable for leadless packaging is clarified.Secondly,the processes such as high temperature low-stress hermetic packaging,low-stress adhesive for chip and leadless electrical connection are studied,and the compatible processes are re‐alized.Finally,the leadless packaging is applied to high temperature pressure sensor chip,and the effect of the packaging is evaluat‐ed.The experimental results show that the leadless packaging’s leak rate is 10E-8 Pa·L/s and the working temperature is 300℃.The research presented in this paper not only will expand the application field of high temperature pressure sensor but also will im‐prove its adaptability and reliability.