一种基于系统级封装技术的控制器设计与验证

Design and verification of controller based on system in package technology

随着后摩尔时代的到来,通过系统级封装技术来实现系统的小型化和集成化已成为集成电路行业发展的新方向,针对当前市场对于控制器低功耗、小型化和集成化的大量需求,提出了一种以系统级封装技术为基础,通过原理设计、封装结构设计、版图设计、信号完整性仿真、电源完整性仿真以及热应力仿真等一系列的设计方法,并结合当前国内的制造工艺水平,研制出了一款全国产化的控制器集成芯片。该集成芯片内部以FPGA为控制核心,集成了射频本振信号源和DDS信号源,实现对射频信号源的控制、输出以及数据通信等功能,最后通过对样片的测试验证,芯片功能稳定,性能满足技术指标要求。与传统的控制器板卡相比,所设计的集成芯片大大降低了产品的功耗,并实现了控制器的小型化和集成化,满足当前的市场应用需求,并为后续控制器类集成芯片的研究提供技术和可行性参考。

With the advent of the post-Moore era,it has become a new direction for the development of the integrated circuit in‐dustry to meet the miniaturization and integration of the system through system-level packaging technology.In view of the large demand for low power consumption,miniaturization and integration of controllers in the current market,this paper proposes a system-level packaging technology.Based on a series of design methods such as principle design,package structure design,lay‐out design,signal integrity simulation,power integrity simulation,and thermal stress simulation,combined with the current do‐mestic manufacturing process level,a fully localized controller integrated chip was developed.The integrated chip takes FPGA as the control core,integrates the RF local oscillator signal source and DDS signal source,and realizes the functions of control,out‐put and communication of the RF signal source.Finally,through the test and verification of the sample,the chip has stable func‐tion and reliable index,which meets the requirements of technical indicators.Compared with the controller board,the designed in‐tegrated chip greatly reduces the power consumption of the product,realizes the miniaturization and integration of the controller,meets the current market application requirements,and provides technical and feasibility reference for the subsequent research of controller integrated chips.