基于模型确认的ASAAC标准均温板模块热响应分析研究

Thermal Performance of Vapor Chamber of ASAAC Module Based on Model Validation

军用电子设备朝着高精度、小体积、轻量化快速发展,导致设备的热流密度越来越高,无法散出的热量会损伤元器件的使用寿命。均温板优异的导热性能,使其在军用领域受到越来越多的关注和研究,本文通过仿真分析及模型确认,对ASAAC模块(内嵌均温板)展开热分析研究,研究结果表明,将ASAAC模块上关键传热路径上的铝合金(6061)更换为均温板后,内部发热器件的平均温度更低,温差更小,温度均匀性更高,散热性能得到显著改善。文中采用的模型确认方法及均温板等效导热系数值可为同类产品的优化设计及验证提供参考。

With the rapid development of high precision,small size and light weight of military electronic equipment,the heat flux is much higher than before.The vapor chamber has been studied by many researchers in the military field because of its excellent heat transfer performance.Therefore,the thermal performance of ASAAC module(Vapor Chamber)is studied by simulation and validation,which is a typical product of airborne defined by the Allied Standard Avionics Architecture Council.The results indicate that the average temperature of the components of ASAAC module(Vapor Chamber)is lower,the temperature uniformity is better,and the heat dissipation performance is significantly improved compared with the ASAAC module(Aluminum Alloy 6061)..The simulation and validation method of the heat dissipation performance of the ASAAC module in this paper is effective and reliable,which can be applied to the optimization of similar airborne products.