导热凝胶的研究进展

Research Progress of Thermal Conductive Gels

概述导热凝胶的组成和导热机理,介绍硅系导热凝胶基体和非硅系导热凝胶基体以及陶瓷材料、碳基材料和复合填料作为导热填料的研究进展。导热凝胶具有热导率大,耐高低温性能和绝缘性能好,塑性、粘性和附着性强,且可重复使用等优点。导热凝胶综合性能提高的关键在于合理设计基体和填料的性质,基体的设计可以从聚合物的类型和相对分子质量及其分布、交联剂、扩链剂等方面进行,并从改变分子链的结构和排列等方面改性聚合物;填料的设计可以从提高导热性能方面进行,如对传统导热填料进行表面功能化以及设计复合填料。

The composition and thermal conduction mechanism of the thermal conductive gel are summarized,and the research progress of silicon-based and non-silicon-based thermal conductive gel matrices,as well as the ceramic materials,carbon based materials and composite fillers as thermal conductive fillers are introduced.The thermal conductive gel has the advantages of high thermal conductivity,good high and low temperature resistance and insulation properties,strong plasticity,viscosity and adhesion,and can be reused.The key to improving the comprehensive performance of the thermal conductive gel lie in the rational design of the properties of the matrix and fillers.The design of the matrix could be carried out from the type and molecular weight of the polymer and its distribution,cross-linking agent,chain extender,etc.,and the polymer could be modified by changing the structure and arrangement of molecular chains.The design of the fillers could be carried out from the perspective of improving thermal conductivity,such as surface functionalization of traditional thermal conductive fillers and the design of composite fillers.