MEMS集成设计与制造技术进展

Advances in MEMS Integrated Design and Manufacturing Technology

芯片技术已成为制约我国高质量发展的瓶颈,基于微机电系统(MEMS)技术的高性能微传感器芯片更是备受欧美“卡脖子”的核心器件之一。“工欲善其事,必先利其器”,与微电子芯片类似,设计及制造技术也是制约MEMS芯片性能的关键。首先,从MEMS设计方法及工具出发,回顾MEMS设计方法从固定流程的结构化设计方法到任意流程的泛结构化设计方法的发展过程,介绍任意流程设计方法的优势,同时介绍目前世界上主流的商用MEMS设计工具并对比典型设计工具的优缺点。其次,介绍MEMS制造技术的特点及面临的挑战,着重分析国际上及几种典型的定制化制造技术以及西北工业大学提出的单掩膜与选择性释放制造方法。随后分析批量化制造技术的优势并给出了国内常见的批量化代工方法及典型批量化代工工艺。最后,指出高端MEMS设计与制造集成的必要性,以期为我国MEMS批量化制造发展提供参考。

Chip technology has become a bottleneck restricting the development of high-quality in China,and the high-performance micro-sensor chip based on micro-electro-mechanical system(MEMS)technology is one of the bottlenecks devices in Europe and America."If you want to do something good,you must first improve your tool",similar to microelectronics chips,design and manufacturing technology is also the key to restricting the performance of MEMS chips.Firstly,starting from MEMS design methods and tools,reviews the development process of MEMS design methods from structured design methods of fixed processes to pan-structured design methods of arbitrary processes,introduces the advantages of arbitrary process design methods,introduces the mainstream commercial MEMS design tools in the world,and compares the advantages and disadvantages of typical design tools.Secondly,the characteristics and challenges of MEMS manufacturing technology are introduced,and several typical customized manufacturing technologies in the world and the single mask and selective release manufacturing methods proposed by Northwestern Polytechnical University are emphatically analyzed.Then the advantages of batch manufacturing technology are analyzed and the common batch foundry methods and typical batch foundry processes in China are given.Finally,the necessity of high-end MEMS design and manufacturing integration is pointed out,in order to provide reference for the development of China's MEMS mass manufacturing.