摘要
当前印制线路板的孔金属化主要通过化学镀铜工艺来实现。但其成分体系复杂,工艺操作繁琐,活化处理所需的贵金属成本高昂,而且其使用的还原剂甲醛具有致癌性。显然,这些不足已经无法满足印制线路板升级发展对表面处理的高要求。为此,本文分析了近些年环保型化学镀铜、钯胶体工艺、黑孔化工艺以及导电聚合物工艺等新型的金属化工艺的研究现状及存在的问题,并阐述了导电聚合物工艺的优越性和实用性。
At present,the hole metallization of printed circuit boards is achieved through electroless copper plating process.However,this treatment process has a complex composition system and a cumbersome process and uses precious metals for activation and carcinogenic formaldehyde as a reducing agent.Obviously,these shortcomings are no longer to meet the high requirements for surface treatment in the upgrading and development of printed circuit boards.To this end,this article analyzes the research status and existing problems of new metallization processes such as environmentally friendly chemical copper plating,palladium colloid process,black hole process,and conductive polymer process in recent years,and elaborates on the advantages and practicality of conductive polymer process.
作者
孙鹏
沈喜训
马祥
朱闫绍佐
徐群杰
Sun Peng;Shen Xixun;Ma Xiang;Zhu Yanshaozuo;Xu Qunjie(School of Environmental and Chemical Engineering,Shanghai University of Electric Power,Shanghai 200090,China;Shanghai Key Laboratory of Materials Protection and Advanced Materials in Electric Power,Shanghai 200090,China;Shanghai Engineering Research Center of Energy-Saving in Heat Exchange Systems,Shanghai 200090,China;Shanghai Academy of Spaceflight Technology,Shanghai 201109,China)
出处
《电镀与精饰》
CAS
北大核心
2023年第12期89-94,共6页
Plating & Finishing
基金
国家自然科学基金面上项目(21972090)
上海市科委项目(19DZ2271100)
中国科学院学部咨询评议项目(2020-HX02-B-030)。
关键词
印制电路板
孔金属化
直接电镀
导电聚合物
黑孔化工艺
printed circuit board
hole metallization
direct plating
conductive polymers
black hole process
