微流体系统在高功率裸芯片模块上的散热研究

Research of heat dissipation in high-power bare chip module with microfluidic system

为解决高热流密度功率裸芯片的散热问题,在功率模块腔体上设置了一种自闭环一体化微流道散热系统。将裸芯片共晶焊接到金刚石,再将金刚石共晶焊接到功率模块腔体,有效降低了裸芯片到功率模块腔体之间的传导热阻。通过实验和仿真探究了微流道形式和流道宽度对散热能力的影响。结果表明:相同条件下交联微流道散热性能较好,同时减小流道宽度,提高芯片温度性能。仿真结果与实验结果具有良好的一致性,最大误差为7.16%。提出的微系统具备较好的散热能力,在环境温度70℃下,可处理的芯片热流密度为320 W/cm^(2)。

In this paper,an integrated micro-fluidic heat dissipation system with self-closing loop is designed in the cavity of power module to improve the heat dissipation of high heat flux power bare chip.The bare chip eutectic is welded to the diamond,and then the diamond eutectic is welded to the power module cavity,effectively reducing the thermal conduction resistance between the bare chip and the power module cavity.The impacts of microchannel configuration and channel width on heat dissipation capacity are investigated through experiments and simulation.Our results show the cross-linked microchannel exhibits better heat dissipation in identical circumstances.Moreover,the reduction of the channel width further improves the temperature performance of chips.The simulation results are highly consistent with the experimental results with a maximum deviation of 7.16%.The micro-fluidic heat dissipation system proposed in this paper demonstrates fairly excellent performance,reaching maximum heat flux density of 320 W/cm^(2)at a temperature of 70℃.