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固溶方式对Al-Zn-Mg-Cu合金组织及性能的影响

Effect of solution treatment on microstructure and properties of Al-Zn-Mg-Cu alloy
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摘要 采用单级固溶、低温长时高温短时以及低温短时高温长时双级固溶淬火制度对热轧态Al-Zn-Mg-Cu系铝合金进行固溶处理,并通过OM,SEM,DSC,EBSD等技术手段以及电导率测试等检测方法,系统地对比分析不同固溶方式对Al-Zn-Mg-Cu系铝合金组织及性能的影响。结果表明:所选用固溶淬火制度不会使组织发生过烧,且能够使组织中的低熔点共晶第二相充分回溶;当选用473℃/20 min+477℃/40 min双级固溶淬火制度时,板材固溶效果最佳,电导率最低,为27.60%IACS,且组织再结晶程度低于50%,组织中主要存在{112}〈111〉,{011}〈211〉,{123}〈634〉变形织构和{001}〈110〉剪切织构。 The hot-rolled Al-Zn-Mg-Cu system aluminum alloy was treated with single-stage solution,low temperature-long term&high temperature-short term and low temperature-short term&high temperature-long term,double-stage solution quenching systems.The effects of different solution methods on the structure and properties of Al-Zn-Mg-Cu system aluminum alloy were systematically compared and analyzed by OM,SEM,DSC,EBSD and other technical means,as well as conductivity testing methods.The results show that the selected solution quenching system will not cause the structure to overheat,and can fully dissolve the eutectic second phase of the low melting point in the structure.When 473℃/20 min+477℃/40 min two-stage solution quenching system is selected,the plate has the best solution effect and the lowest conductivity,which is 27.60%IACS,and the recrystallization degree of the structure is less than 50%.There are{112}〈111〉,{011}〈211〉,{123}〈634〉deformation texture and{001}〈110〉shear texture in the structure.
作者 王经涛 孙宁 余浪 李星辉 麻芳 王永红 程志远 郭丰佳 WANG Jingtao;SUN Ning;YU Lang;LI Xinghui;MA Fang;WANG Yonghong;CHENG Zhiyuan;GUO Fengjia(National Engineering Research Center for Plastic Working of Aluminium Alloys,Shandong Nanshan Aluminium Co.,Ltd.,Longkou 265713,Shandong,China;Shandong Aluminum Alloy Pressure Processing Technology Innovation Center,Shandong Nanshan Academy of Science and Technology Co.,Ltd.,Longkou 265713,Shandong,China;College of Chemical Engineering and Technology,Yantai Nanshan University,Longkou 265713,Shandong,China)
出处 《航空材料学报》 CAS CSCD 北大核心 2023年第6期65-72,共8页 Journal of Aeronautical Materials
关键词 固溶处理 AL-ZN-MG-CU合金 显微组织 电导率 织构 solution treatment Al-Zn-Mg-Cu alloy microstructure conductivity texture
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