高功率射频微波用聚四氟乙烯及其复合材料关键技术

Pivotal Technique of Polytetrafluoroethylene and Its Composites for High-Power, Radiofrequency and Microwave Applications

随着电子领域朝着高速传输、高连接密度的方向发展,对5G设备中广泛使用的覆铜板提出了低介电常数、低介电损耗、高导热率、高可靠性等技术要求。聚四氟乙烯(PTFE)覆铜板以其优异的介电性能和化学稳定性被广泛应用于高频微波电路领域,但现有PTFE覆铜板的制备在单体纯化、树脂聚合、填料改性、复合材料以及制品加工全链条中存在的问题限制了其实际应用。本文总结了近年来PTFE覆铜板的发展历程以及高频PTFE覆铜板面临的理论及技术难点,分别从高黏结性PTFE的分子设计及序列分布控制、高纯PTFE的全流程杂质含量可控及绿色产业化技术、新型填料制备及表面处理新技术、多相多组分PTFE复合材料的组成与界面设计、覆铜板的加工流变性与结构均匀性控制等方面提出了提升PTFE覆铜板性能的方法,以期能发展从树脂结构、填料改性、复合材料到成型加工的系统基础理论,从而制备高性能PTFE覆铜板。

As the electronics field is increasingly developing in the direction of high-speed transmission and high connection density,the copper clad laminates widely used in 5G equipment have technical requirements such as low dielectric constant,low dielectric loss,high thermal conductivity,high reliability,et al.Polytetrafluoroethylene(PTFE)copper clad laminates are widely used in high-frequency microwave circuits because of their excellent dielectric properties and chemical stability.However,the preparation of existing PTFE copper clad laminates has related problems in the whole chain of monomer purification,resin polymerization,filler modification,composite materials to product processing,which limits their practical applications.This paper summarizes the development process of copper clad laminates in recent years,and proposes methods to solve the performance of PTFE from the aspects of molecular design and sequence distribution control of high cohesive PTFE,controllable impurity content of the whole process of high purity PTFE and green industrialization technology,new filler preparation and surface treatment technology,composition and interface design of multi-phase and multi-component PTFE composite materials,processing rheology and structural uniformity control of copper clad laminates,etc.,so as to develop a system basic theory from the aspects of resin structure,filler modification,composite to molding processing,and the preparation of high-performance PTFE copper clad laminate.