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镀铜碳纳米管对铜基复合薄膜组织及性能的影响

Impact of copper-plated carbon nanotubes on microstructure and properties of copper-based composite films
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摘要 解决碳纳米管团聚问题以及改善碳纳米管与基体材料间界面的结合是提升碳纳米管铜基复合薄膜性能的关键.文中通过对比碳纳米管铜基复合薄膜和镀铜碳纳米管铜基复合薄膜的组织和性能的差异,结合量子隧道效应、DLVO理论以及材料力学相关理论,分析了镀铜碳纳米管对复合薄膜组织及性能的影响.结果表明,未镀铜和镀铜的碳纳米管含量为1.0%(质量分数)时,碳纳米管铜基复合薄膜和镀铜碳纳米管铜基复合薄膜电阻率分别为25.17和17.73μΩ·cm,在不同的弯曲循环次数下的电阻变化率均是前者大于后者.碳纳米管镀铜后,其尺寸和表面结构所发生的改变抑制了团聚,提高了其与铜基体之间的结合强度,进而提升复合薄膜性能.从增强材料对复合材料的组织和性能影响的角度出发,得出了镀铜碳纳米管对铜基复合薄膜组织及性能的影响机理,为后续柔性印刷电子技术的研究提供理论依据. Solving the problem of carbon nanotube aggregation and improving the interface between carbon nanotubes and matrix materials are the key to improving the properties of carbon nanotube copper-based composite films.In this study,the influence of copper-plated carbon nanotubes on the microstructure and properties of composite films has been conducted by comparing the differences in microstructure and properties between carbon nanotube copper-based composite films and copper-plated carbon nanotube copper-based composite films.This analysis involve the application of the quantum tunneling effect,DLVO theory and relevant material mechanics theories.The results indicate that at a content of 1.0%(mass fraction)of uncoated carbon nanotubes and copper-plated carbon nan-otubes,the electrical resistivity of carbon nanotube copperbased composite films and copper-plated carbon nanotube copper-based composite films are 25.17μΩ·cm and 17.73μΩ·cm respectively.The rate of change in resistance under different bending cycles has been found to be greater for the former than for the latter.After copper plating on carbon nanotubes,the changes in their size and surface structure suppress agglomeration,enhance their joining strength with the copper matrix,and ultimately enhance the properties of composite films.Considering the influence of reinforcing materials on the microstructure and properties of composite materials,the mechanism of the influence of copper-plated carbon nanotubes on the microstructure and properties of copper-based composite films has been obtained.These findings provide a theoretical basis for subsequent research on flexible printing electronic technology.
作者 赵鑫宇 刘强 程国文 林铁松 黄永德 ZHAO Xinyu;LIU Qiang;CHENG Guowen;LIN Tiesong;HUANG Yongde(Nanchang Hangkong University,Nanchang,330063,China;Harbin Institute of Technology,Harbin,150001,China)
出处 《焊接学报》 EI CAS CSCD 北大核心 2023年第12期56-62,I0006,I0007,共9页 Transactions of The China Welding Institution
基金 国家自然科学基金资助项目(52065048) 先进焊接与连接国家重点实验室开放课题研究基金(AWJ-22Z02)。
关键词 碳纳米管 镀铜碳纳米管 团聚 结合强度 carbon nanotubes copper-plated carbon nanotubes aggregation joining strength
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