摘要
低温烧结纳米银焊膏具有优越的热、电和力学性能,成为宽禁带半导体器件封装互连的关键材料之一,高服役温度下,烧结银的氧化和分解会引起电化学迁移的发生,可能导致电子器件的短路失效.在纳米银焊膏中添加氧亲和力更高的铟颗粒,采用竞争氧化的思路可以抑制烧结银的电化学迁移.与烧结纳米铟焊膏(382 min)相比,烧结Ag-3In和Ag-5In(质量分数,%)焊膏的电化学迁移寿命提高至779和804 min,提高约1倍;分析了铟粉对烧结银在高温干燥环境中电化学迁移失效的抑制机理.服役过程中,铟颗粒优先于银颗粒与氧气发生反应生成In_(2)O_(3),从而抑制了烧结银的氧化、分解和离子化过程,显著提高了烧结银的电化学迁移失效时间,与此同时,与烧结银焊膏相比,烧结Ag-1In与Ag-3In(质量分数,%)焊膏的抗剪强度分别提升了30.92%和32.37%.结果表明,纳米铟粉的引入可以显著提高烧结银的电化学迁移寿命.
Low temperature sintered nanosilver pastes have superior thermal,electrical and mechanical properties,making them one of the die-attach materials in wide band semiconductor devices.However,the oxidation and decomposition of sintered silver at high temperatures cause the occurrence of electrochemical migration,which may lead to short-circuit failure of electronic devices.Therefore,the competitive oxidation method is used,the electrochemical migration of sintered Ag is suppressed by adding In particles with higher oxygen affinity to the nano-Ag paste.The electrochemical migration lifetimes of sintered Ag-3In and Ag-5In pastes were significantly improved to 779 min and 804 min compared to sintered nano-Ag solder paste(382 min),which is about two times higher.Subsequently,the inhibition mechanism of In particles on the electrochemical migration of sintered silver in high temperature dry environment was analyzed.During the service process,In particles reacted with oxygen in preference to Ag particles to form In_(2)O_(3),which inhibited the oxidation,decomposition and ionization of sintered Ag and significantly improved the electrochemical migration failure time of sintered silver.Meanwhile,the shear strength of sintered Ag-1In and Ag-3In pastes was improved by 30.92%and 32.37%,respectively,compared with that of sintered Ag paste.It was shown that the introduction of the appropriate proportion of In particles was effective in improving the shear strength of the die-attach samples while improving the electrochemical migration lifetime.
作者
张博雯
王微
冯浩男
赵志远
鲁鑫焱
梅云辉
ZHANG Bowen;WANG Wei;FENG Haonan;ZHAO Zhiyuan;LU Xinyan;MEI Yunhui(Tiangong University,Tianjin,300387,China)
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2023年第12期63-69,I0007,共8页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(52177189,52107203,51922075)
天津市科学技术委员会资助项目(21JCJQJC00150)。