电介质表面金属导线激光直写技术研究进展

Research progress of laser direct writing technologies for the conductive metallic wire on dielectric surface

电介质表面金属导线在微电子、光电子、机电系统等领域的需求极大.作为一种无掩膜柔性制造技术,激光直写可在多种电介质表面制造任意形状金属导线,近年来迅速发展.基于激光与材料相互作用的光化学和光热效应,电介质表面金属导线激光直写技术可分为光致化学还原金属离子、选择性激光烧结、激光诱导向前转移、激光加热还原金属离子等.文中详细介绍了几种金属导线激光直写技术的原理、特点以及最新研究进展,并对激光直写技术在金属导线的制造中的发展进行了总结和展望.

Fabrication of conductive metallic wire on dielectric surface has a broad application in microelectronics,optoelectronics,electromechanical systems,etc.As a very promising alternative,laser direct writing is a maskless,efficient,and flexible approach that readily allows for free-form writing of a wide range of conductive metallic patterns on substrates,and hence has attracted an enormous amount of attention in the past several years.Laser direct writing can be achieved via photochemical or photothermal process,including photochemical reduction of metal ions,laser induced forward transfer,laser heating reduction of metal ions,etc.Herein,the laser direct writing strategies for fabrication of conductive metallic wires including the principle,characteristics and research progress have been reviewed in detail.Furthermore,remaining challenges and development trends are summarized and prospected.