摘要
随着5G的推广,对符合5G频段要求的密封器件的需求也随之增大,密封器件上使用的太赫兹频段的玻璃密封绝缘子的技术指标也随之提升,满足该指标要求的玻璃绝缘子的体积也极小。本文介绍了在现有的技术及工艺水平上,通过计算机模拟、改进工装及生产工艺制造出满足技术指标的玻璃绝缘子。
With the promotion of 5G,the demand for sealing devices that meet the requirements of the 5G frequency band has also increased.The technical indicators of the glass sealing insulators in the terahertz frequency band used on the sealing devices have also been improved.The volume is also extremely small.This article introduces the use of computer simulations,improved tooling and production processes to produce glass insulators that meet technical indicators on the existing technology and process level.
作者
王辰
赵建波
王强
石鹏
WANG Chen;ZHAO Jian-Bo;WANG Qiang;SHI Peng(China Electronics Technology Group Corporation No.40 Research Institute,Bengbu233010 China)
出处
《机电元件》
2023年第6期18-22,共5页
Electromechanical Components