多层印制电路板镀通孔应力-应变MBPTH模型

Stress-Strain Model in Plated Through-Holes of Multilayer Printed Circuit Boards

镀通孔作为印制电路板的关键组件,其可靠性成为了印制板可靠性问题的关键因素。现有的镀通孔应力-应力模型大多把镀通孔简化为一维结构,没有考虑到多层板结构和外部焊盘因素,本文在已有模型基础上,考虑多层板镀通孔结构和影响其应力-应变分布的因素,建立合理的镀通孔应力-应变模型,用于快速评估多层印制电路板上镀通孔的寿命。同时利用有限元分析结果对建立模型的合理性和准确性进行了验证和修正,使得模型更符合工程情况。

As a critical component of printed circuit boards,the plated through-hole has become the key factor in the reliability issues of printed boards.Existing plated through-hole stress-strain models often simplify the plated through-hole as a one-dimensional structure and overlook factors related to the multi-layer board structure and external pads.In this paper,building upon existing models,we consider the multi-layer board through-hole structure and factors affecting its stress-strain distribution to establish a reasonable plated through-hole stress-strain model.This model is used for rapid assessment of plated through-hole lifetimes on multilayer printed circuit boards.The rationality and accuracy of the model were validated and refined using finite element analysis results,which aligned the model more closely with engineering conditions.