基于COMSOL的中央厨房餐品微波加热包装仿真研究

Simulation on microwave heating packaging for central kitchen meals based on COMSOL

为了探究包装对于中央厨房餐品微波加热的影响,该文采用盒装土豆泥作为研究对象,借助COMSOL Multiphysics仿真软件模拟电磁场与传热等三维多物理场的耦合过程,构建有无包装盖膜2种几何模型,将微波加热过程中电场分布和温度分布状态可视化,绘制特征点的温度变化曲线,并与实验结果进行比较。结果表明,有盖膜组土豆泥微波加热特征点温度模拟值和实验值的均方根误差(root mean square error,RMSE)平均值为2.955℃,温度均匀系数(covariance of temperature,COVT)的RMSE值为0.011,无盖膜组特征点温度模拟值和实验值的RMSE平均值为2.538℃,COVT的RMSE值为0.022,模型与实际拟合度高,表明模型在探究包装对餐品微波加热的影响方面具有较高的可靠性与准确性。

To explore the influence of packaging on microwave heating of the central kitchen meals,two three-dimensional heat transfer models were established to simulate the coupling process of the electromagnetic field and heat transfer of mashed potatoes with or without packaging lid film based on COMSOL Multiphysics in this paper.The electric field distribution and temperature distribution states in the heating process were visualized,and the temperature curves of feature points were obtained,which were compared with the experimental results.Results showed that during the process of microwave heating,the average value of root mean square error(RMSE)of feature points of mashed potatoes with packaging lid film between the simulation and experiment was 2.955℃,and the RMSE value of COVT was 0.011,while the average RMSE value of feature points of mashed potatoes without film between the simulation and experiment was 2.538℃,and the RMSE value of COVT was 0.022.The model was highly fitted to reality,so it was proved that the model had high reliability and accuracy in exploring the influence of packaging on microwave heating of central kitchen meals.