半固化片制造过程中填料球磨工艺变更对PCB涨缩的影响

The effect of filler ball milling process changes in the prepreg manufacturing on the expansion and shrinkage of PCB

随着电子行业的发展,印制电路板(PCB)设计越来越倾向于高多层、小间距球栅格阵列结构(BGA)产品,这就对PCB厂家提出了高对位精度的要求。通常影响PCB对位精度的最大因素为涨缩,而涨缩主要受覆铜基板、半固化片(PP)等影响。通过对比PP制造过程中填料球磨工艺变更前后产品涨缩的变化,验证PP制造工艺对产品涨缩的影响。

With the development of the electronics industry,printed circuit board(PCB)design is more and more prone to high multi-layer,small pitch ball grid array(BGA)products,which puts forward high alignment accuracy requirements for PCB manufacturers.Usually,the biggest factor affecting PCB alignment accuracy is the expansion,and the expansion are mainly affected by copper-coated substrate,prepreg(PP),etc.This paper verifies the effect of PP manufacturing process change on product growth and shrinkage by comparing the changes before and after filler ball milling process change.