PCB化学镀铜界面失效微观形态研究

Study on the micromorphology of interface failure in PCB electroless copper plating

化学镀铜和电镀铜是印制电路板(PCB)孔金属化的关键制程,盲孔底部和通孔的内层互连结构均存在电镀铜-化铜-基铜三者的结合界面,化铜镀层质量是界面结合强度的关键影响因素。结合化铜层微空洞、盲孔底部和内层互连界面失效的典型微观形貌,分析了孔金属化制程因素对化铜镀层质量和界面结合强度的影响,为PCB化学镀铜的生产质量管控、界面结合强度改善和产品可靠性提升提供参考。

Electroless copper plating and electroplating copper are key processes for hole metallization in printed circuit boards(PCBs).The interconnection structures of the bottom of blind holes and the inner layer of through holes both have a bonding interface among electroplating copper,electroless plating copper and base copper.The quality of the copper plating layer is a key factor affecting the interfacial bonding strength.The article analyzes the typical micro morphology of copper plating layer micro voids,blind hole bottom,and inner layer interconnection interface failures in the hole metallization process,and analyzes the effects of process factors on the quality of copper plating and interface bonding strength.This provides reference for the production quality control,interface bonding strength improvement,and product reliability improvement of electroless copper plating.