摘要
本文以萘醌、DOPO、酚醛环氧树脂及异氰酸酯为原料,合成了一种高耐热低羟基含磷环氧树脂。将其与酚醛及苯并噁嗪树脂混胶后,浸在玻纤布中经压板固化后,通过示差扫描量热(DSC)测试了板材的玻璃化转变温度T_(g);采用平板电容法测试了树脂的介电性能,并测试了树脂的吸水率、阻燃性能、羟基当量等。结果表明,板材的玻璃化转变温度T_(g)高于170℃,板材具有较低的介电常数和介质损耗,D_(k)<3.50,D_(f)<0.01,吸水率<0.2%,阻燃达到V0级,作为覆铜板的基础树脂材料时,具有低介电、低介损、高T_g、低吸水、V0级阻燃等优良的综合性能。
A novel phosphorus-containing epoxy with high heat resistance and low hydroxyl was synthesized from naphthoquinone,DOPO,phenolic epoxy and isocyanate.The glass transition temperature T_(g) and dielectric properties of the resin were measured by differential scanning calorimetry(DSC)and plate capacitance method,respectively.The results showed that the glass transition temperature T_(g) was higher than 170℃,the dielectric constant and dielectric loss were lower,D_(k)<3.50,D_(f)<0.01,water absorption<0.2%,and the flame retardant was V0.When it was used as copper clad laminate base resin material,it had low dielectric,low dielectric loss,high T_(g),low water absorption,V0 flame retardant and other excellent comprehensive properties.
作者
叶伦学
唐文东
邹静
曹静
YE Lunxue;TANG Wendong;ZOU Jing;CAO Jing(Sichuan EM Technology Co.,Ltd.,The State of Insulation Materials Engineering Technology Research Center,Mianyang 621000,China)
出处
《化工技术与开发》
CAS
2023年第12期24-26,31,共4页
Technology & Development of Chemical Industry
关键词
低羟基含磷环氧树脂
低介电常数
低介质损耗
低吸水率
高耐热
low hydroxyl phosphorus epoxy
low dielectric constant
low dielectric loss
low water absorption
high heat resistance