电子芯片厂房装配式钢-混凝土组合结构方案设计与受力性能分析

Design and Mechanical Property Analysis of Prefabricated Steel-Concrete Composite Structure for Electronic Chip Plants

针对电子芯片厂房的结构特点和需求,提出了采用钢管混凝土柱+型钢组合梁+不出筋叠合板的装配式组合结构体系,与传统现浇混凝土结构体系相比,新型组合结构体系的材料成本增加33%,但施工周期缩短28%,模板工程量减少46%,综合效益显著。对装配式组合框架结构和传统现浇混凝土结构进行数值计算分析,发现采用装配式组合结构后,结构的自振特性和破坏模式相同,但地震下结构的层间位移角变小,说明结构的抗震性能提升。需要注意的是,相比于现浇混凝土结构体系,采用装配式组合结构体系楼盖的自振频率由51.6 Hz降低至30.1 Hz,活载下的竖向挠度由0.15 mm增加至0.39 mm,对于微振动敏感的电子车间的适用性仍然需要进一步探究。

A prefabricated composite structure system composed of concrete-filled steel tubular columns,steel beams,and composite slabs without protruding rebars was proposed in response to the requirements and structural characteristics of electronic chip plants.Compared to traditional cast-in-place concrete structures,the new composite structure incurs a 33%increase in material costs but reduces the construction period by 28%and diminishes the template engineering quantity by 46%,resulting in substantial overall benefits.Moreover,a numerical analysis was conducted on the prefabricated composite frame structure and the traditional cast-in-place concrete structure.The prefabricated composite structure was observed to have better seismic resistance by decreasing the interlayer displacement angle under earthquake conditions while maintaining the same natural vibration characteristics and failure modes as the traditional structure.However,it is important to note that in comparison to the cast-in-place concrete structure system,the floor’s natural vibration frequency using the prefabricated composite system decreased from 51.6 Hz to 30.1 Hz,and the vertical deflection under live load increased from 0.15 mm to 0.39 mm.Therefore,the applicability of the system for electronic workshops that are sensitive to micro-vibrations still needs to be further explored.