摘要
基因测序技术正处于快速发展阶段,作为灵敏度极高的测序技术——纳米孔测序,对薄膜电极的电阻率和储能特性提出了更高的要求。为了降低薄膜的电阻率并提高储能特性,本文利用反应磁控溅射方法,基于原位生长原理,分别制备了TiO_(x)N_(y)和Ti/TiN/TiO_(x)N_(y)电极薄膜。采用扫描电子显微镜、X射线衍射仪和电化学工作站对薄膜的微观结构、化学成分及其电化学性能进行研究。结果表明,在TiN高导电性和TiO_(x)N_(y)高比表面积的协同作用下,Ti/TiN/TiO_(x)N_(y)电极薄膜表现出优异的电化学性能。当电流密度为0.15 mA/cm^(2)时获得7.01 mF/cm^(2)的比电容,是TiO_(x)N_(y)电极薄膜比电容值的1.3倍。同时,与TiO_(x)N_(y)单电极相比,Ti/TiN/TiO_(x)N_(y)电极薄膜电阻降低约2个数量级。分析发现:将致密结构的TiN用作集流体引入疏松多孔的TiO_(x)N_(y)单电极中,可以有效降低Ti/TiN/TiO_(x)N_(y)体系内阻,同时保持良好的比电容,可为磁控溅射方法制备高性能基因测序芯片电极提供理论基础。
Gene sequencing technology is currently in a rapid development stage.As a highly sensitive sequencing method,nanopore sequencing demands higher requirements on the resistivity and energy storage characteristics of film electrodes.In order to reduce the resistivity of the film and improve its energy storage characteristics,TiO_(x)N_(y)and Ti/TiN/TiO_(x)N_(y)electrode films were prepared using the reactive magnetron sputtering method based on the in-situ growth principle.The films were analyzed in terms of the microstructure,chemical composition,and electrochemical properties using scanning electron microscopy,X-ray diffractometer,and an electrochemical workstation.The results indicated that the Ti/TiN/TiO_(x)N_(y)electrode film exhibits excellent electrochemical properties due to the synergistic effect of the high conductivity of TiN fluid collector and high specific surface area of TiO_(x)N_(y)porous electrode.At a current density of 0.15 mA/cm^(2),a specific capacitance of 7.01 mF/cm^(2)was obtained,which is 1.3 times higher than that of the TiO_(x)N_(y)electrode film.Meanwhile,the resistance of the Ti/TiN/TiO_(x)N_(y)electrode film decreased by approximately two orders of magnitude compared to that of the TiO_(x)N_(y)single electrode.It has been found that introducing TiN with a dense structure as a fluid collector into the porous TiO_(x)N_(y)single electrode can effectively reduce the internal resistance of the Ti/TiN/TiO_(x)N_(y)system while maintaining excellent specific capacitance.This finding provides a foundation for preparing high-performance gene sequencing chip electrodes by magnetron sputtering.
作者
王梦晓
徐进
苏云鹏
顾佳烨
孙纳纳
周大雨
WANG Mengxiao;XU Jin;SU Yunpeng;GU Jiaye;SUN Nana;ZHOU Dayu(Key Laboratory of Three-beam Material Modification(School of Materials Science and Engineering,Dalian University of Technology),Ministry of Education,Dalian 116024,China;Dalian Chip Materials&Thin Film Technology Co.,Ltd.,Dalian 116085,China;Geneus Technology(Chengdu)Co.,Ltd.,Chengdu 610041,China)
出处
《材料科学与工艺》
CAS
CSCD
北大核心
2023年第6期1-8,共8页
Materials Science and Technology
基金
国家自然科学基金资助项目(51972037)。
关键词
基因测序
第四代DNA测序技术
磁控溅射
TiN电极薄膜
电化学性能
gene sequencing
fourth-generation DNA sequencing technology
magnetron sputtering
TiN electrode film
electrochemical performance