引线键合中焊盘裂纹的产生原因及改善方法

Causes and Improvement Methods of Pad Cracks in Wire Bonding

引线键合是封装的关键工序之一。通过第一焊点同芯片焊盘键合、第二焊点同基板键合及线弧成形的方法实现电路的导通连接,进而实现产品的功能。在第一焊点同芯片焊盘键合的过程中,焊盘会受到一定的键合应力,过大的应力易造成焊盘裂纹,导致产品失效。因此,第一焊点的键合强度及引线键合参数的设置尤为重要。通过优化焊盘结构、引线键合参数及键合作业模式的方法来降低发生焊盘裂纹的风险,为避免不同材质及结构的焊盘出现焊盘裂纹提供参考。

Wire bonding is one of the key processes in packaging.By bonding the first solder joint with the chip pad,bonding the second solder joint with the substrate and forming a wire arc,the circuit is connected to achieve the function of the product.In the process of bonding the first solder joint to the chip pad,the pad is subjected to a certain bonding stress,and excessive stress is likely to cause pad cracks and result in product failure.Therefore,the bonding strength of the first solder joint and the setting of wire bonding parameters are particularly important.By optimizing the structures of pads,wire bonding parameters and bonding operation modes,the risk of pad cracking can be reduced.This method provides a reference for avoiding the occurrence of pad cracks in pads with different materials and structures.