正性光敏型聚酰亚胺的研究和应用进展

Recent Progress of Positive Photosensitive Polyimide

随着光刻工艺的发展,光敏型聚酰亚胺(PSPI)已成为当下电子化学品领域的研究热点,并且广泛应用于芯片制造领域。文中综述了具备正性光刻功能的正性光敏聚酰亚胺(p-PSPI)近年来的研究与应用进展,介绍了目前各种p-PSPI的结构特点、合成路线、性能指标以及提高其性能的工艺方法。系统分析了功能基团修饰、光敏剂、添加剂等对p-PSPI光刻胶的灵敏度、对比度、分辨率、力学性能、热稳定性等的影响。以低温固化型p-PSPI为实例,介绍了可以在低温下发生亚胺化反应的p-PSPI制备工艺。最后,总结了目前国内p-PSPI产品与世界先进水平间存在的差距。

With the development of photolithography technology,photosensitive polyimide(PSPI)has become a research hotspot in the field of electronic chemicals and is widely used in the field of chip manufacturing.The research and application progress of positive photosensitive polyimide(p-PSPI)with positive photolithography function in recent years were reviewed in this article.The structural characteristics,synthetic routes,performance metrics and methods for improving the performance of various p-PSPI were introduced.The effects of functional group modification,photoactive compounds and additives on the sensitivity,contrast,resolution,mechanical properties and thermal stability of p-PSPI were systematically analyzed.Taking low-temperature curable p-PSPI as example,the preparation process of p-PSPI through imidization reaction at low temperature was introduced.Finally,the gap between domestic p-PSPI products and products of the world advanced level was summarized.