摘要
铌酸锂作为一种优良的多功能晶体材料,在光学、声学、电学和电子领域应用较广。已有研究表明,在集成光电子器件应用中对铌酸锂晶片进行键合,可提高器件的传输频率,降低损耗,实现高集成密度。该文总结了近年来国内外有关铌酸锂晶片键合技术的研究现状,介绍了键合强度的分析方法,以及铌酸锂键合晶圆在集成光电子器件中的最新研究进展,展望了铌酸锂键合技术的未来发展。
Lithium niobate,as an excellent multifunctional crystal material,has been widely used in the fields of optics,acoustics,electricity and electronics.Some studies have shown that in the application of integrated optoelectronic devices,lithium niobate wafer bonding can increase the transmission frequency of the device,reduce losses,and achieve high integration density.This paper summarizes the research status of lithium niobate wafer bonding technology at home and abroad in recent years,introduces the analysis methods of bonding strength,and the latest progress of lithium niobate bonded wafers in integrated optoelectronic devices,and looks forward to the future development of lithium niobate bonding technology.
作者
孔辉
沈浩
张忠伟
钱煜
濮思麒
徐秋峰
王勤峰
KONG Hui;SHEN Hao;ZHANG Zhongwei;QIAN Yu;PU Siqi;XU Qiufeng;WANG Qinfeng(TGD Kaiju Technology Co.,Ltd.,Xuzhou 221000,China;TGD Holdings Co.,Ltd.,Jiaxing 314000,China)
出处
《压电与声光》
CAS
北大核心
2023年第6期926-934,共9页
Piezoelectrics & Acoustooptics
基金
浙江省科技计划基金资助项目(2022C01240)。
关键词
铌酸锂
键合
光电子器件
集成
调制器
lithium niobate
bonding
optoelectronic device
integration
modulator