高热导率材料的发展和应用

Development and Application of Materials with High Thermal Conductivity

概述了高热导率材料的分类、优缺点、制备方法和应用,包括陶瓷基封装材料、聚合物基封装材料和金属基封装材料。重点论述了金属基复合材料的应用和分类,金属层合板轧制工艺的研究,Cu/MoCu/Cu-Cu-MoCu-Cu(CPC)金属基层状复合材料的发展等。

Classification,advantages and disadvantages,fabricating method and application of the materials with high thermal conductivity were summarized,involving ceramic matrix packaging materials,polymer matrix packaging materials,and metal matrix packaging materials.The key points discussed were as follows:the application and classification of metal matrix composites,the research on rolling process of the metal laminates,and the development of Cu/MoCu/Cu-Cu-MoCu-Cu(CPC)layered metal matrix composite,etc.