基于PTFE材料的印制电路板背钻塞孔加工工艺研究

Research on the Processing Technology of Drilling Plug Holes on the Back of Printed Circuit Board Based on PTFE Material

当前PTFE材料PCB背钻树脂塞孔性不良率较高,缺乏加工方案与工艺参数标准。本文基于塞孔机理及其力学模型分析结果,开展PTFE材料性能试验,实验表明PTFE板材在高温熔融压合过程中压合后板内的微孔结构对此类材料背钻塞孔不良有重要影响。基于此类材料开展加工实验,得出塞孔前烘板和时效管理以及塞孔抽真空的加工方法能有效解决PTFE板材自身难浸润性和涨缩不稳定导致板内微孔隙的水汽问题,从而减少塞孔凹陷,使PTFE材料PCB背钻塞孔FTY提升3倍。

At present,the defect rate of back drilling resin plug holes on PTFE material based PCB is high,and there is a lack of processing plans and process parameter standards.Based on the mechanism of plug holes and the analysis results of its mechanical model,this article conducted performance tests on PTFE materials.The tests showed that the microporous structure in PTFE sheets after high temperature melting and pressing is an important adverse factor affecting the poor back drilling plug holes of such materials.Based on this type of material,processing experiments have been conducted,and the processing methods of drying the board before the plug hole,aging management,and vacuuming of the plug hole can effectively solve the problem of water vapor in the micro pores inside the PTFE board due to its hard wettability and unstable expansion and contraction,thereby reducing the plug hole depression and increasing the FTY of the plug hole drilled on the back of the PTFE material PCB by three times.This research work provides important reference significance for the back drilling plug hole process of PTFE printed PCB.