基于空间限域强制组装法制备环氧树脂导热层压复合材料

Preparation of Epoxy Resin Thermally Conductive Laminated Composite Based on Spatial Confining Forced Network Assembly Method

目前,电子设备的散热方法已经不能满足日益增长的需求,严重影响了设备的稳定性和使用寿命。电子设备内部将积累大量的热元素,因此,制备具有高导热性的层压复合材料对于提高散热能力十分重要。为了解决该问题,将环氧树脂(EP)作为基体、氮化硼(BN)作为导热填料、玻璃纤维布(GFs)作为增强材料。BN被3-氨基丙基三聚硅氧烷(APTES)改性,更好地提高复合材料热导率。通过空间限域强制组装法制备EP/GFs/BN层压复合材料,作为导热复合材料应用。EP/GFs/BN-30层压复合材料的最高热导率为1.139 W/(m·K),与纯EP相比,提高了5倍。EP/GFs/BN层压复合材料还具有较好的力学、电绝缘和介电性能。

The power consumption of electronic equipment was constantly increasing.The current means of heat dissipation in electronic equipment could no longer meet the increasing requirements,which would seriously affect the stability and service life of the equipment.Since a large amount of heat elements would accumulate inside electronic devices,the preparation of laminated composite with high thermal conductivity was necessary to improve the heat dissipation capability.To solve this problem,epoxy resin(EP)was used as the matrix,boron nitride(BN)as the thermally conductive filler and glass fiber cloth(GFs)as the reinforcement.BN was modified with 3-aminopropyltrisiloxane(APTES)to better improve thermal conductivity.The EP/GFs/BN laminates were prepared by a space-limited forced assembly method and applied as thermally conductive composite.The highest thermal conductivity of the EP/GFs/BN-30 laminate was 1.139 W/(m·K),which was five times higher than that of pure EP.The EP/GFs/BN laminate also had good mechanical,electrical insulation and dielectric properties.