面向高密度印刷电路板圆形特征的快速铺铜算法

Fast shape filling algorithm for circular features in highdensity PCB

随着印刷电路板的高度集成化,传统的芯片安装和散热无法满足整体尺寸和重量的要求。铺铜作为PCB设计环节中最后进行的关键步骤,在提高电路板性能和有效性方面具有重要作用。本文针对高密度印刷电路板上存在的圆形特征,提出了一种基于完整图形的信息分类和区域计算的快速铺铜算法,并对铺铜过程中产生的孤岛提出了搜索方案。其核心思想如下:首先根据图形信息对大量特征进行区域划分,然后根据碰撞关系对其分簇,基于分簇结果得到外包络边链和孤岛边链,最后通过环和孔的边链关系得到铺铜结果。算法在3.20 GHz、16 GB内存的Windows 10环境下运行,使用工业用例测试数据进行验证。实验结果表明,与开源的基于拟合多边形的铺铜工具相比,在面向大规模场景时,铺铜结果不依赖于拟合多边形边数,时间缩短了约60%。

With the increasing integration of printed circuit board,traditional methods are unable to meet the requirements for size and weight.Copper plating,a crucial step in PCB design,plays a significant role in improving the performance and effectiveness of PCB.To address the numerous circular features on largescale PCB,a fast shape filling algorithm is proposed.This algorithm utilizes graphic information classification and identifies islands that may arise during the copper plating process.The core idea of the algorithm is as follows:firstly,a large number of features are divided into regions based on their graphical information.Then,clustering is performed based on collision relationships.The outer contour chains and isolated island chains are obtained based on the clustering results.Finally,the result is obtained through the relationship between the contour chains of loops and holes.The algorithm is implemented in a Windows 10 environment with a 3.20 GHz processor and 16 GB memory,and industrial test data is used to validate its performance.The experimental results demonstrate that compared to an opensource copper plating tool based on fitting polygons,the proposed algorithm is independent of the number of polygon edges and achieves a time improvement of approximately 60%.