“莫斯”项目化解半导体制造成本困境做法

Strategies employed by MOSIS Program to alleviate semiconductor manufacturing costs

从“莫斯”(MOSIS)项目发展历程、扮演的半导体供应链集成商角色、服务模式、制造能力等方面进行深入研究和分析,并提出对我国的启示。自1981年启动至今,美国国防高级研究计划局的MOSIS项目为美国国防部、高校和科研院所、集成电路设计公司等持续提供包含设计、制造、封装、检测等环节在内的全流程集成电路拼版制造服务。楷登、新思和明导等公司的先进电子设计工具,IBM、三星、台积电、英特尔、欧洲硅光子学支持中心等公司和机构提供的硅、硅光电、化合物半导体等先进制造能力,有效降低了半导体制造成本,特别是一定程度化解了美国国防部无力负担先进制造成本的困境,在推动美国超大规模集成电路发展、半导体产业人才培养等方面取得显著成效。

An in-depth exploration of various dimensions of the Metal Oxide Silicon Implementation Service(MOSIS)Program,including its historical evolution,role as a linchpin in the semiconductor supply chain,operational model,and manufacturing prowess is provided,thereby yielding insights that may be pertinent for our own national context.Initiated in 1981 by the U.S.Defense Advanced Research Projects Agency(DARPA),the MOSIS Program has consistently offered a comprehensive suite of integrated circuit prototyping services.These services span design,manufacturing,packaging,and testing,catering to a wide array of stakeholders,including the U.S.Department of Defense,academic institutions,research centers,and integrated circuit design firms.By harnessing advanced electronic design tools from companies such as Cadence,Synopsys,and Mentor Graphics,coupled with cutting-edge manufacturing capabilities in areas such as silicon,silicon photonics,and compound semiconductors from industry leaders like IBM,Samsung,TSMC,Intel,and ePIXfab,the financial burdens associated with semiconductor manufacturing have been effectively mitigated by the MOSIS Program.This has been particularly salient in easing the U.S.Department of Defense’s struggle with the soaring costs of advanced manufacturing techniques.Further,the program has substantially contributed to developing very-large-scale integrated circuits in the United States,as well as nurturing talent in the semiconductor sector.