钯含量对银铜钯合金箔带钎料性能的影响

Effect of Palladium Content on the Properties of Silver Copper Palladium Alloy Foil Strip Solder

钎焊是一种常用的金属连接方法,然而钎焊过程中产生的一些不良现象,如氧化膜、气孔等,影响了合金钎焊料的质量和可靠性。本论文旨在探讨钯对银铜钯箔带合金钎焊清洁性的影响,并寻找提高其清洁性的方法。通过实验研究和分析,发现添加钯银铜钯合金钎料能够有效减少氧化膜的生成,并提高钎焊接头的力学性能和界面的稳定性。钯银铜合金箔带的钎焊接头在气孔方面也呈现出明显的改善。此外,钯的添加还能够改善钎焊接头的焊接质量,为箔带材合金钎料的广泛应用提供了有力支持。

Brazing is a commonly used method of metal connection.However,some adverse phenomena such as oxide film and pores generated during the brazing process affect the quality and reliability of alloy brazing consumables.The purpose of this paper is to explore the effect of palladium on the cleanliness of silver copper palladium foil strip alloy brazing,and to find methods to improve its cleanliness.Through experimental research and analysis,it was found that adding palladium silver copper palladium alloy solder can effectively reduce the formation of oxide films and improve the mechanical properties and interface stability of the brazed joint.The brazing joint of palladium silver copper alloy foil strip also shows significant improvement in terms of porosity.In addition,the addition of palladium can also improve the welding quality of brazed joints,providing strong support for the widespread application of foil strip alloy brazing materials.