摘要
采用塑性变形连接方法制备了TC17合金/TC4合金连接接头,通过金相显微镜(OM)和扫描电子显微镜(SEM)等微观组织表征方法及单向剪切试验,研究了不同连接参数下TC17合金/TC4合金连接界面的微观组织与力学性能,分析了其内在联系,并探究了空洞组织的演化机制。结果表明:连接压力和连接温度对TC17合金/TC4合金连接界面的空洞演化、界面结合率和剪切强度影响更为显著。由于TC17合金/TC4合金连接界面塑性流动和原子扩散的协同作用,连接界面接触面积增大,界面处产生较大的局部应变,空洞由短棒状转变为椭圆形再变为圆形,并逐渐减小直至消失,从而使界面结合率提高,剪切强度增大。
TC17/TC4 bonds were fabricated by plastic deformation bonding,the microstructure and mechanical properties of TC17 alloy/TC4 alloy joint interface under different joining parameters were studied by means of metallographic microscope(OM),scanning electron microscope(SEM)and unidirectional shear tests,etc.Their internal relations were analyzed and the evolution mechanism of void structure was explored.The results show that the influence of bonding pressure and bonding temperature on the void evolution,bonding ratio and shear strength of TC17 alloy/TC4 alloy bonding interface is more significant.Due to the synergism of plastic flow and atomic diffusion of TC17 alloy/TC4 alloy bonding interface,the contact area of the interface increases and generates a large local strain at the interface.The voids change from short rod shape to oval shape and then to round shape,which gradually decrease until disappear.As a result,the bonding ratio improves and the shear strength increases.
作者
孙利星
姜琪
李莲
李淼泉
SUN Li-xing;JIANG Qi;LI Lian;LI Miao-quan(Engineering Research Center of Conductive Materials and Composite Technology,Ministry of Education,Xi’an University of Technology,Xi’an 710048,China;School of Materials Science and Engineering,Northwestern Polytechnical University,Xi’an 710072,China)
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2023年第10期3229-3238,共10页
The Chinese Journal of Nonferrous Metals
基金
国家自然科学基金资助项目(52104385)
陕西省教育厅重点科研计划资助项目(21JY030)
西安市科协青年人才托举计划(095920221357)。
