摘要
化学机械抛光(CMP)是一种化学腐蚀和机械磨削协同作用的超精密加工技术。化学机械抛光液是化学机械抛光技术中关键的一部分,对材料的全局平坦化处理起到了至关重要的作用。综述了化学机械抛光液中各组分对抛光性能的影响研究。
Chemical mechanical polishing(CMP)is a kind of ultra-precision machining technology with synergistic effect of chemical corrosion and mechanical grinding.CMP solution is a key part of CMP technology,which plays a vital role in the global planarization processing of materials.The influence of components of chemical mechanical polishing solution on polishing performance is summarized.
作者
王东哲
张恒飞
付玉
刘茂举
庄锐
蔡颖辉
Wang Dongzhe;Zhang Hengfei;Fu Yu;Liu Maoju;Zhuang Rui;Cai Yinghui(Yellow River Delta Chambroad Institute Company Limited,Binzhou,Shandong 256600,China;High-End Chemical Engineering and New Materials Institute(Chambroad),Shandong University,Jinan,Shandong 250100,China)
出处
《化学世界》
2024年第1期60-66,共7页
Chemical World
关键词
化学机械抛光液
组分
影响研究
chemical mechanical polishing solution
component
influence research