pH调节剂在CMP工艺中的应用研究进展

Research Progress of the Application of pH Regulator in CMP Process

pH调节剂在化学机械抛光(CMP)工艺中有重要应用,可以调节抛光液的pH值以确保抛光过程的化学反应在理想的pH值下进行,同时保持抛光化学环境的稳定等。对无机酸、有机酸、无机碱和有机碱四大类pH调节剂在合金、金属和金属化合物等材料的CMP中的应用及其作用机理进行综述。无机酸pH调节剂的主要作用机理是快速腐蚀材料表面,但其主要缺点是会将多余的金属离子引入抛光液中污染金属表面。有机酸pH调节剂的主要作用机理是螯合金属离子形成大分子络合物,但其主要缺点是稳定性差,难以保存。无机碱pH调节剂的主要作用机理是在基底表面生成一层软化层,使其在机械作用下更容易被去除,但其主要缺点是仍会引入金属离子污染材料表面。有机碱pH调节剂的主要作用机理是加速钝化膜的形成,但其主要缺点是制备困难、成本高。最后对pH调节剂在CMP中的应用前景进行了展望。

pH regulator has important applications in chemical mechanical polishing(CMP)process.It can adjust the pH value of the slurry to ensure that the chemical reactions occur at the ideal pH value during the polishing process,while maintaining the stability of the polishing chemical environ-ment.The applications and mechanisms of four types of pH regulators,namely inorganic acids,organic acids,inorganic alkali and organic alkali,in CMP of materials such as alloys,metals and metal com-pounds are reviewed.The main mechanism of the inorganic acid pH regulator is to rapidly corrode the surface of materials,but its main disadvantage is that it will introduce excess metal ions into the polishing slurry and pollute the metal surface.The main mechanism of the organic acid pH regulator is to chelate metal ions to form macromolecular complexes,but its main disadvantage is poor stability and difficulty in preservation.The main mechanism of the inorganic alkali pH regulator is to generate a softening layer on the substrate surface,which is easier to be removed under mechanical action.However,its main disad-vantage is that it still introduces metal ions to pollute the material surface.The main mechanism of the organic alkali pH regulator is to accelerate the formation of passivation film,but its main disadvantage is the difficulty in preparation and high cost.Finally,the applications of pH regulators in CMP are prospected.