一种弹载电子设备的热控方式设计及仿真分析

Design and Simulation Analysis of A Thermal Control Method for Missile-Borne Electronic Equipment

弹载电子设备通常只能采用被动热控方式,为了提升弹载电子设备的有效工作时长,满足更为严苛的温度环境适应性要求。本文设计了一种在不改变电子设备结构的情况下,通过外挂热沉的方式延长电子设备有效工作时长,实现任务剖面条件下的电子设备有效热控。本文对比分析了外挂不同形式热沉对电子设备在任务剖面条件下工作时长的影响,明确了不同结构形式的热沉对电子设备的热控特点,本研究将为弹载电子设备热控设计提供参考。

Electronic equipment in ballistic equipment can usually only use passive thermal control mode,in order to extend the effective working time of electronic equipment in ballistic equipment to meet the more stringent temperature environment adaptability requirements.In this paper,we design a way to extend the effective working time of electronic equipment by external heat sink without changing the structure of electronic equipment,and realize the effective thermal control of electronic equipment under the condition of mission profile.In this paper,the influence of different external heat sink on the working time of electronic equipment under the condition of mission profile is compared and analyzed,and the thermal control characteristics of different structural heat sinks on electronic equipment are defined.This study will provide reference for the thermal control design of electronic equipment in ballistic equ ipment.