一种空间受限大功率VPX机箱热设计与分析

Thermal Design and Analysis of Space-Limited and High Power VPX Cabinet

为解决19英寸标准1U插箱在体积极度有限条件下的散热问题,开展了一种空间受限大功率VPX机箱热设计工作。首先,针对机箱热耗及散热要求,进行了系统风量计算、风机选型以及风道优化工作。其次,由于机箱中信号处理板热耗较大且热点分布复杂,设计了一种防风道短路、无散热死区的高性能冷板结构。最后,采用基于Icepak的CFD仿真方法验证了该方案的有效性,并模拟了高温条件下关键芯片的温度变化情况。结果表明,改进后的冷板结构避免了原结构中子板散热不良的缺点。同时,在有限空间内实现了各发热芯片的散热要求。

To solve the heat dissipation problem of 19 inch standard 1U cabinet under limited volume,the thermal design of space-limit-ed and high power VPX cabinet is carried out.Firstly,according to the total power of cabinet and demands of dissipation,the system air volume is calculated,the fan type is selected and air passage is optimized.Secondly,due to the high power of signal processing board and complex position of hotspot,a better cold plate with no air short circuit and no dead zone of heat dissipation is designed.Finally,the efficiency of the proposed method is validated through CFD thermal simulations based on Icepak,the temperature rise of key chips under high temperature condition is simulated.The result shows that the poor heat dissipation of sub-board is avoided after the cold plate im-proved.Meanwhile,the heating chips are all qualified for the temperature demands under limited space.