多孔吸液芯均热板的现状研究

Research on Current Situation of Porous Wicking Soaking Plate

随着时代的进步,技术的不断革新,电子产品为了满足人们的需求在不断变小变薄,但功耗却在不断变大,更小的散热面积以及更大的功耗使得芯片热通量和工作温度的控制问题十分严峻,而一旦热流无法及时排出,会导致产品性能表现变差甚至烧坏。均热板具有优异的导热性能,较大传热面积、较好的均温性能和高可靠性等优点,是解决电子设备散热问题的首要途径。基于此,对均热板传热原理进行概述,重点综述国内外以多孔材料为吸液芯的均热板结构设计研究现状,包括气液通道排布结构和工质选择等,介绍目前多孔材料吸液芯的部分研究方法和方向,并分析了目前研究成果,最后对均热板未来的研究趋势和发展前景进行了科学的展望。

With the progress of the times and the continuous innovation of technology,electronic products are becoming smaller and thinner to meet people's needs,but their power consumption is constantly increasing.The smaller heat dissipation area and the larger power consumption make the control of chip heat flux and operating temperature very severe.Once the heat flow cannot be discharged in time,it will lead to poor performance and even burnout of the product.The soaking plate has excellent thermal conductivity,large heat transfer area,good temperature uniformity performance and high reliability,which is the primary way to solve the heat dissipation problem of electronic equipment.Based on this,an overview of the heat transfer principle of the soaking plate is summarized,focusing on the research status of the structural design of the soaking plate with porous material as the wicking core at home and abroad,including the gas-liquid channel layout structure and the selection of working medium.Some research methods and directions of porous material wicking core are introduced,and the current research results are analyzed.Finally,the future research trend and development prospects of the soaking plate are scientifically prospected.