SiC功率模块的液冷散热设计与节能分析

Thermal Design and Energy Saving Analysis of Liquid Cooling for SiC Power Module

为综合评估SiC功率模块的液冷冷板散热效果,设计了串联、并联与串并联3种冷板流道结构,从器件温升、系统能效、散热性能3个方面共计10项指标评估了冷板性能,基于ICEPAK仿真分析了液冷系统流场与温度场的稳态分布特征,从节能角度给出了液冷散热方案的工程应用选择与优化建议。研究结果表明,冷板内部串联流道设计的温升与散热性能指标更优,但其能效表现系数仅为并联设计的1/5,散热表现的提升以增加冷板内部压力损失为代价,降低了其能效表现;3种流道设计下,冷却液流量由8.2 L/min提高至24.6 L/min,冷板的能效表现系数分别由1 275,6 407,1 425下降至53.2,258.3,60.6,故提高冷却液流量并非改善散热的首选。实际工程应用中,在器件的温升允许范围内,应优先选择冷板内部的并联流道设计与多冷板间并联的散热方案,以提高散热系统的节能性。

In order to comprehensively evaluate the cooling effect of the liquid cooling plate of SiC power module,three kinds of cold plate runner structures in series,parallel and series parallel were designed.The cold plate performance was evaluated from 10 indicators of device temperature rise,system energy efficiency and heat dissipation performance.The steady-state distribution characteristics of the flow field and temperature field of the liquid cooling system were analyzed based on ICEPAK simulation.From the perspective of energy saving,the project application selection and optimization of liquid cooling scheme were given.The results show that the temperature rise and heat dissipation performance indexes of the series runner design are best,but its energy efficiency coefficient of performance is only 1/5 of that of the parallel design.The improvement of heat dissipation performance reduces the energy efficiency at the cost of increasing the pressure loss inside the cold plate.For the three runner designs,the coolant flow rate is increased from 8.2 L/min to 24.6 L/min,and the energy efficiency coefficient of the cold plate are decreased from 1275,6407,and 1425 to 53.2,258.3,and 60.6,respectively.Increasing the coolant flow rate is not the first choice to improve heat dissipation.In practical engineering applications,within the allowable range of temperature rise of the device,the parallel runner design and the parallel heat dissi‐pation scheme between multiple cold plates should be preferred,so as to improve the energy saving of the heat dissipation system.