电子互连无铅钎料及焊点蠕变行为研究进展

Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection

针对近年来无铅钎料及焊点的蠕变失效问题,综合评述了蠕变变形行为及其在焊点可靠性评估中的应用。首先系统地介绍无铅钎料的蠕变行为,探讨含合金元素/颗粒无铅钎料蠕变性能改性机制。其次评述焊点蠕变行为,探讨焊点成分以及不同基板材料对焊点蠕变特性影响的研究进展。再次结合具体电子器件,采用有限元模拟,分析基于有限元的焊点蠕变响应及疲劳寿命预测,评估焊点可靠性。最后针对无铅钎料及焊点蠕变行为的未来发展进行展望,分析其研究中存在的问题及解决办法,为焊点可靠性进一步研究提供理论支撑。

For the creep failure of lead-free solders and solder joints in recent years,the creep deformation behavior and its application in reliability of solder joint were reviewed.Firstly,the creep behavior of lead-free solders was systematically introduced,and the creep modification mechanism of lead-free solders bearing alloying elements or particles was discussed.Secondly,the creep behavior of solder joints was reviewed,and the research progress about the influence of solder joint composition and substrate materials on the creep behavior of solder joints was analyzed.Furthermore,for specific electronic devices,the creep response and fatigue life prediction of solder joints based on finite element method were analyzed by finite element simulation,and the reliability of solder joints was evaluated.Finally,the future development of creep behavior of lead-free solder and solder joint was prospected,and the existing problems and solutions were analyzed to provide theoretical support for further research on solder joint reliability.