面向超精密加工的微观材料去除机理研究进展

Research Advance on Material Removal at Microscale towards Ultra-precision Manufacturing

随着超大规模集成电路、微机电系统、精密光学等高新技术领域对超高精度表面和结构需求的不断增加,超精密加工正成为各国争夺的科技“制高点”。超精密加工的本质是通过微观材料的可控添加、迁移或去除实现超高精度表面或结构加工。将重点综述单点金刚石切削、扫描探针加工、化学机械抛光和超精密磨削等几种以接触模式实现微观材料去除的超精密加工技术的研究进展,并系统总结了加工参数、加工工具、加工环境和加工对象本身物化特性对微观去除的影响机制,以及不同机制主导下的材料微观去除模型及适用范围。最后,总结了未来超精密加工技术发展至原子尺度实现材料可控去除将面临的挑战。

Ultra-precision manufacturing has been as the competitive frontier for most of coastal countries and regions with the incremental demands for ultra-high precision surfaces and structures in the hi-tech industrializations such as ultra-large-scale integrated circuits,microelectromechanical systems,and precise optics.The essence of ultra-precision manufacturing is to fabricate ultra-high precision surface or structure through the controllable addition,migration,or removal of the microscopic materials.This study reviewed the latest advances of several types of ultra-precision manufacturing technologies such as single point diamond turning,scanning probe lithography,chemical mechanical polishing,and ultra-precision grinding,which normally remove the materials at micro-scale under contact state.After that,the effects of processing parameters,processing tools,processing environment,and physical and chemical characteristics of the processed materials themselves on the material removal at microscale were systematically summarized and the microscale removal models matched the different dominated mechanisms were reviewed.Final,the challenges that will be encountered in the future development of ultra-precision manufacturing to achieve the controlled material removal at the atomic scale were prospected.