界面黏接对软电介质薄膜临界击穿场强影响的试验研究

Experimental study on the effect of interfacial bonding on the critical breakdown field strength of soft dielectric thin films

软电介质薄膜因模量低、可大变形、适应性强等特点,被广泛应用于电气和电子系统中。但由于材料的介电常数较低,通常需要在较高的电场环境下服役。在高电场环境下,软电介质薄膜易产生失稳和电击穿破坏,影响着材料的应用范围和稳定性。本研究针对电极对软电介质薄膜有无约束两种情况对此类器件的稳定性展开了研究:首先定量描述了电极对电介质无约束时,电压加卸载过程中失稳形貌的演化规律;其次讨论了例如氯化锂水凝胶等软电极对薄膜力电失稳的抑制,并利用化学黏接的方式增强水凝胶电极对电介质薄膜的约束,提升了电介质薄膜的临界击穿场强。

Soft dielectric thin films are widely used in electrical and electronic systems due to their low modulus,large deformation and strong adaptability.However,due to the low dielectric constant of the material,they usually need to serve in high electric field environment.Under high electric field,soft dielectric film is prone to instability and electrical breakdown.It affects the application range and stability of the material.In this paper,the stability of this kind of device is studied under the condition that the electrode s constraint on the soft dielectric film.First,the evolution law of the instability morphology in the process of voltage loading and unloading is described when the electrode has no constraint on the dielectric.Then,the inhibition of electromechanical instability by soft electrodes such as lithium chloride hydrogel is discussed.The chemical bonding method was used to strengthen the constraint of hydrogel electrode on the dielectric film,and the critical breakdown field strength of the dielectric film was increased.