直流支撑电容器圆元件的散热模型与仿真研究

Study on Heat Dissipation Model and Simulation of Circular Element for DC⁃link Capacitor

随着自愈干式金属化薄膜电容器应用范围的不断扩展,其散热方式与内部温升问题成为了重要的理论与工程问题。鉴于此,本文基于直流支撑电容器圆元件的发热规律,分析了电容器元件圆柱状整体均匀发热时发热体的热流分布。进一步,结合电热对偶原理,建立了圆元件热计算模型,并通过微分单元积分,得到了圆元件的热阻计算公式。最后,通过试验验证了圆元件的热计算模型的正确性,且提出了圆元件热计算的验证方法,为直流支撑电容器圆元件的发热提供理论与试验参考。

With the continuous expansion of application range of self-healing dry metallized film capacitor,its heat dissipation mode and internal temperature-rising have become important theoretical and engineering problems.In view of this,the heat flow distribution of heating body of overall heating and even heating of cicular element of capacitor is analyzed on the basis of the heating rule of the circular element of the DC-link capacitor.Furthermore,the thermal calculation model of the circular element is set up in combination with the principle of electro-thermal duality,and the thermal resistance calculation formula of a circular element is obtained through the integration of the differential cells.Finally,the correctness of the thermal calculation model of circular element is verified through the test,and the verification method of thermal calculation of circular element is proposed,which will provide theoretical and test reference for the heating of circular element of DC-link capacitor.