倾斜排列差分过孔间串扰抑制方案

Crosstalk suppression scheme between inclined differential vias

针对高频下多层板上过孔间的串扰问题,提出了2种倾斜排列的差分过孔方案。所提方案在平行差分过孔排列方式的基础上将差分过孔偏移,通过倾斜排列来减小相邻差分信道间的耦合。在0.1~30 GHz的频域内对方案进行了仿真和分析。结果表明倾斜排列的差分过孔间串扰水平明显低于平行排列的差分过孔。相较于平行排列,在串扰抑制的最大点处,单对倾斜排列过孔的差分远端串扰和差分近端串扰分别降低了21.3 dB和6.9 dB,两对倾斜排列过孔差分远端串扰和差分近端串扰分别降低了10.5 dB和15.5 dB。

To address the crosstalk issue between differential vias on multilayer boards at high frequencies,two differential via schemes with inclined arrangement were proposed.In the proposed schemes,the differential vias were shifted based on the parallel differential via arrangements,and the coupling between adjacent differential channels was reduced by inclined arrangement.Simulation and analysis were performed in the frequency domain of 0.1~30 GHz.Results demonstrate that differential vias with inclined arrangement exhibit significantly lower crosstalk compared with differential vias with parallel arrangement.Compared with parallel arrangement,the differential far-end crosstalk and differential near-end crosstalk are reduced by 21.3 dB and 6.9 dB for single-pair inclined vias at the maximum point of crosstalk suppression,while the double-pair inclined vias exhibit reductions of 10.5 dB in differential far-end crosstalk and 15.5 dB in differential near-end crosstalk.