芯片制造用含氟电子特气的研究进展

Research progress on fluorine-containing electronic special gases for chip manufacturing

含氟电子特气主要用于芯片制造过程中的刻蚀和清洁工段,是不可或缺的关键性化工材料。该文比较了传统含氟电子特气和新型含氟电子特气,重点总结了新型含氟电子特气的主要合成路线,并指出最佳的产业化路线;介绍了芯片制造用含氟电子特气的发展现状;最后,针对当前含氟电子特气的主要知识产权被国外发达国家所垄断,且刻蚀和清洁工序的分步操作导致工序繁复且效率低下,难以满足高端芯片集成度和良品率等更高的精度需求问题,提出今后研究应开发满足国家重大战略需求的新一代含氟电子特气,具备刻蚀/清洁协同双功能,具有简化工序、提高效率、提升芯片制造良品率的优点,实现对当前刻蚀和清洁仅能分步操作的含氟电子特气的理想替代。

Fluorine-containing electronic special gases are indispensable key chemical materials mainly used in the etching and cleaning section of the chip manufacturing process.In this review,the traditional and new fluorine-containing special gases were firstly compared,with the main synthetic routes of the new fluorine-containing special gases summarized and the best industrialization route pointed out.The development status of fluorinated electronic special gases for chip manufacturing was then introduced.Finally,in view of the problems that the main intellectual property rights of fluorine-containing electronic special gases are currently monopolized by foreign developed countries,and the step-by-step operation of etching and cleaning processes leads to complicated and inefficient processes,which is difficult to meet the higher precision requirements such as high-end chip integration and yield,it was suggested that the future research directions should mainly focus on the development of new generations with the dual functions of etching/cleaning synergy,which can meet the major strategic needs of the country and have the advantages of simplifying the process,improving efficiency and the chip manufacturing yield,as well as replacing the current ones that are only used in a step-by-step manner.