表面活性剂在集成电路多层布线CMP工艺中的应用研究

Research on the Application of Surfactant in CMP Process for Multi-layer Wiring of Integrated Circuits

随着集成电路(IC)特征尺寸不断缩小,集成电路多层布线加工精度面临更高的要求,而化学机械抛光(CMP)凭借化学腐蚀和机械磨削的耦合协同作用,成为实现晶圆局部和全局平坦化的唯一可靠技术。抛光液作为CMP工艺中关键要素之一,其主要成分表面活性剂的选择以及含量会严重影响晶圆的表面质量。介绍表面活性剂的特性及其类型,回顾近年来国内外表面活性剂在集成电路多层布线相关材料CMP中的应用及作用机制,归纳总结得出表面活性剂在CMP过程中可以起到缓蚀保护、增强润湿、分散磨料、去除晶圆表面残留污染等多种作用,具有广泛的应用领域。同时,对表面活性剂在CMP中的应用前景进行了展望。

As integrated circuit(IC)feature sizes continue to shrink,the processing accuracy of IC multi-layer wiring is facing higher demands,and chemical mechanical polishing(CMP),with its coupled synergy of chemical etching and mechanical grinding,is the only reliable technology to achieve local and global wafer planarization.The slurry is one of the key factors in the CMP process,the choice and content of surfactant as the main component can seriously affect the surface quality of wafers.The characteristics of surfactant and its types were introduced,and the application and mechanism of surfactant in CMP of IC multi-layer wiring-related materials at home and abroad in recent years were reviewed.It is concluded that surfactant can play a variety of roles in CMP process,such as corrosion protection,wetting enhancement,abrasive dispersion,removal of residual contamination on wafer surface and so on,which has a wide range of applications.At the same time,the prospect of surfactant application in CMP was presented.