老化工艺研究

Study on Burn-In Technology

芯片在制造和封装过程中,传统的晶圆级测试和封装测试无法满足芯片较高性能指标和较高稳定性的要求,目前,国内外主要采用老化工艺来筛除芯片制造工序中引入的早期失效和封装过程中造成的潜在不良品,本文主要针对老化工艺流程、老化机理、故障机理进行研究。

In the process of manufacturing and packaging,the traditional wafer testing and packaging testing cannot meet the requirements of high-performance index and high stability of the chip.At present,the burn-in technology is mainly used to screen the early failure and the potential bad products in the packaging process.This paper mainly studies the burn-in process,the burn-in mechanism and the failure mechanism.