摘要
智能功率模块(IPM)相较于传统封装有着更小的体积与更高的集成度。这使得它有着更高的可靠性并逐步取代传统的功率控制系统成为市场主流。在如今,智能功率模块有着广阔的发展前景,受到了广泛关注。然而其相较于传统封装更为复杂的内部结构给塑封带来了更大的挑战。塑封是指塑封料通过流动包覆的方式将芯片与完成互联的半成品包封起来与外界环境隔绝。这会形成保护,给下一步的电子组装提供可加工的电子个体。智能功率模块由于其塑封体更大更复杂,塑封时往往会形成困气或填充不足。即部分区域缺失固化的塑封树脂。这会影响成品的外观,降低产品良率,造成经济损失。因此,本文通过有限元仿真的方式探究了现有设计发生包封或填充不足的主要原因。同时探索了数种不同的改进方法对于模流的影响。
Compared to traditional packaging,Intelligent Power Modules(IPMs)offer smaller volume and higher integration,making them more reliable and gradually assume the leading role of traditional power control systems in the market.Nowadays,IPMs have vast prospects for development and have garnered widespread attention.However,their more complex internal structure,compared to traditional packaging,presents greater challenges in molding."Molding"refers to the process where the compound is used to encase chips and interconnected semi-finished prod-ucts,isolating them from the external environment.This provides protection and produces processable electronic com-ponents for following electronic assembly.Due to the larger and more complex encapsulation body of IPMs,issues like air trapping or insufficient filling,meaning missing cured molding compounds in particular areas,can occur during the encapsulation process.This can adversely affect the appearance of the final product,reduce yield rate,and lead to economic losses.Therefore,this paper investigates the primary causes of insufficient filling in current designs through finite element simulation and explores the effects of various improvement methods on mold flow.
作者
刘元成
龚平
陈莉
LIU Yuan-cheng;GONG Ping;CHEN Li(Wuxi China Resources Technology Co.,LTD.)
出处
《中国集成电路》
2023年第12期86-90,共5页
China lntegrated Circuit
关键词
塑封
IPM
有限元分析
molding
IPM
finite element analysis