粘片焊料二次流淌对铝硅丝键合衬底可靠性影响研究

Study on the Influence of Die Bonding Solder Secondary Flow on the Reliability of Aluminum-Silicon Wire Bonding Substrate

以某款器件在一致性检验的内部目检中发现的失效现象为依托,开展试验研究。针对铝硅丝无法直接键合在芯片安装材料之上的问题,从粘片焊料在封帽过程中的重熔现象进行分析,对有问题的键合丝做300℃、24 h存储试验和125℃、168 h寿命试验,测试键合拉力和断点位置。试验后键合拉力满足国军标要求,断裂位置也不在金铝键合界面处出现,能够有效解释粘片焊料二次流淌对铝丝键合衬底可靠性的影响,避免问题再次发生。

Based on the failure phenomenon found in the in-line inspection of a device,an experi-mental study was carried out.Aiming at the problem that the aluminum-silicon wire can't be directly bonded to the chip mounting material,the remelting phenomenon of the die bonding solder in the process of sealing the cap is analyzed,the storage test at 300℃for 24 h and the life test at 125℃for 168 h are carried out to test the bonding tension and breakpoint position.After the test,the bonding tension meets the requirements of the national military standard,and the fracture position does not appear at the Au-Al bonding interface,which can effectively explain the influence of the secondary flow of the die solder on the reliability of the aluminum wire bonding substrate and avoid the recurrence of the problem.