摘要
阐述碳化硅的特性,采用低电感封装和定制化引脚布局,实现高开关频率,以及先进焊接与连接技术、良好散热。探讨一款用于电源PFC应用的16mΩ1200V六单元碳化硅模块设计和实现,对标某知名品牌62.8mm六单元碳化硅模块,经需求识别、产品定义、设计优化、制造、测试,产品性能满足需求。
This paper describes the characteristics of silicon carbide,using low inductance packaging and customized pin layout to achieve high switching frequency,as well as advanced welding and connection technology and good heat dissipation.It explores the design and implementation of a 16mΩ1200V six-pack silicon carbide module for power PFC applications,benchmarking against a well-known brand's 62.8mm six-pack silicon carbide module.After requirement identification,product definition,design optimization,manufacturing,and testing,the product performance meets the requirements.
作者
杨承晋
刘旭
兰华兵
刘涛
YANG Chengjin;LIU Xu;LAN Huabing;LIU Tao(Shenzhen SGKS Technology Co.,Ltd.,Guangdong 518000,China.)
出处
《集成电路应用》
2023年第11期414-417,共4页
Application of IC
关键词
碳化硅
模块设计
封装技术
六单元
silicon carbide
module design
packaging technology
six-pack