微系统封装关键工艺设备发展现状及国产化分析

Analysis of Development Status and Domestic Production Process for Electronics Manufacturing Equipment Used in Microsystem Packaging

以硅通孔(TSV)、再布线(RDL)、微凸点(Bumping)、封装组装为典型特征的微系统封装技术已成为后摩尔时代集成电路发展的新趋势,其实现途径的主要基础工艺包括光刻、刻蚀、薄膜沉积、电镀、键合、减薄等。从微系统封装工艺出发,系统梳理了主要工艺设备需求、发展现状以及国产化进展。通过现状及趋势的分析对比,认为微系统封装技术已进入行业发展机遇期,其所需的工艺设备对制程节点要求相对较低,对设备种类要求较多,可作为制造设备国产化的重要平台大力发展,提升半导体产业链供应链韧性与安全水平。

Three-dimensional stacking process represented by Through Silicon Via(TSV),Re-Distributed Layer(RDL),micro bump,and advanced packaging,which integrates modules with different functions and materials onto a single chip,has become a new trend in the development of integrated circuits in the post-Moore era.The main basic processes for its implementation include photolithography,etching,thin film deposition,electroplating,bonding,thinning.This article briefly introduces the packaging technology of microsystems,and elaborates on the current development status and localization progress of its main process equipment.Through analysis and comparison,this article believes that microsystem packaging industry development has entered the rapidly growth period,and its required process equipment has relatively low requirements for process nodes but more needs in equipment types.It can be used as an important platform for impulsing localization of manufacturing equipment to vigorously develop,to enhance the tenacity and security level of the semiconductor industry chain and supply chain.